Preparation for this year’s Motek/Bondexpo as a face-to-face trade fair is running at full bore. The sector is looking forward to the traditional trade fair duo comprising the 39th Motek international trade fair for automation in production and assembly and the 14th Bondexpo international trade fair for bonding technology. The favourable booking status confirms just how eagerly the leading trade fair for the world of automation is being awaited from the 5th through the 8th of October, 2021. The issue of “Software for Assembly” and the “Arena of Integration” will occupy a central location in hall 1.
For the first time ever at Motek 2021, a unique platform for digitalisation in production and assembly will be established on the basis of a new “Software for Assembly” exhibition area. The presentation is organised along the entire product lifecycle and deals with several topics: software for product lifecycle management, for sales, for service and for product development and design. Special attention will be focused on software for production and assembly, as well as machine-related software and control technology. Beyond this, the “Arena of Integration” (AoI) is being prepared as a show highlight: “The AoI will be further developed at Motek 2021 as a vital centrepiece of the Software for Assembly exhibition area,” reports Mike Döring from project management at trade fair promoters P.E. Schall GmbH & Co. KG. “Interconnectivity between software and assembly technology in motion will be presented at the AoI, which make business processes mapped by software vividly visible and tangible with the help of exhibits.”
Assembly operations and suppliers of assembly technology represent one of the largest markets for operational software solutions. Digitalisation of assembly is currently a central challenge for these target groups, both of which are represented traditionally at the Motek trade fair. “Decision-makers from sales and design engineering are on hand as regular exhibitors at Motek,” explains Döring. “We bring them together with the appropriate expert visitors at Motek/Bondexpo: plant managers, planners and purchasing agents.” In this way, users receive direct answers to their specific questions from the manufacturers of standard variant products.
Solo or Collective Booth: Motek/Bondexpo Supports Networking
The industrial manufacturing sector is constantly implementing interconnectivity, digitalisation and automation processes. Motek/Bondexpo translates these topics into actual practice in keeping with the trade fair motto: “automation intelligence for production and assembly”. Exhibitors can organise their presentations on their own floor space or at a collective booth.
“We support networking as it’s lived out in practice,” explains Döring with regard to the different levels of collaboration. As a result, lots of interesting turnkey solutions will be presented at the trade fair – for new markets as well.”
The Motek/Bondexpo trade fair duo is once again demonstrating ideal interaction amongst all involved parties. The complementary Bondexpo event focuses on industrial joining and bonding technology: nearly any combination of materials – of identical or different types – can be joined with the help of this technology without suffering any loss of material properties or the associated advantages. This fall’s trade fair highlight in Stuttgart has been firmly scheduled as a personal get-together for an outstanding business community from the 5th through the 8th of October, 2021!